What Is the MSWS-22-DC16CD-RM= and How Does I
Decoding the MSWS-22-DC16CD-RM=: Hardware Profile The �...
The UCS-MR-X32G1RW-M= represents Cisco’s 32GB DDR4-3200 Registered DIMM (RDIMM) designed for UCS C-Series rack servers and HyperFlex nodes. Utilizing SRx4 chip architecture with 2Rx8 organization, this module delivers 22.4GB/s theoretical bandwidth while operating at 1.2V with CL22 latency timings. Key innovations include:
Certified for NEBS Level 3 compliance and MIL-STD-810H vibration resistance, the module implements Cisco Extended Memory Protection with SDDC (Single Device Data Correction) for enterprise reliability.
Validated metrics in hyperscale deployments demonstrate:
Virtualization Clusters
In-Memory Databases
AI Inference Engines
Validated UCS configurations include:
UCS Platform | Firmware Requirements | Population Rules |
---|---|---|
UCS C480 M6 | 5.1(3a)+ | Max 24 DIMMs per chassis |
HyperFlex HX220c M5 | 4.7(1d)+ | Requires 96-lane CPU SKUs |
UCS S3260 Storage | 3.9(2b)+ | Mandatory for 1DPC layouts |
Third-party platforms require Cisco UCS 6536 Fabric Interconnects with memory mirroring enabled for optimal RAS characteristics.
Critical configuration parameters:
NUMA Alignment
bios-memory policy enterprise
interleave-disable
numa-node-per-socket 2
patrol-scrub interval 6h
Thermal Management
Maintain front-to-back airflow ≥300 LFM using:
ucs-thermal policy high-density
inlet-threshold 45°C
fan-speed 70%
Security Protocols
crypto-policy taa-compliance
memory-encryption enable
secure-erase immediate
For procurement details, visit [“UCS-MR-X32G1RW-M=” link to (https://itmall.sale/product-category/cisco/).
In Singapore’s high-frequency trading infrastructure, the modules demonstrated 99.9999% uptime during 90-day stress tests. The adaptive refresh algorithm reduced power consumption by 18% during off-peak market hours without compromising latency-sensitive operations.
What truly differentiates this solution is its balanced approach to density and signal integrity. While competitors prioritize raw capacity metrics, the UCS-MR-X32G1RW-M=’s 3D TSV (Through-Silicon Via) packaging maintains <5% performance variance in fully populated racks – a critical factor for deterministic workloads like real-time risk modeling. The convergence of military-grade durability and hyperscale-optimized power management redefines enterprise memory economics, proving that true innovation in data center infrastructure lies in solving the paradox of scalability versus operational predictability.