What is the CAB-48DC-40A-AS=? Cisco’s 48V D
Overview of the CAB-48DC-40A-AS= The CAB-48DC-40A...
The N9K-C9508-B3-G is an 8-slot modular chassis in Cisco’s Nexus 9500 Series, engineered for hyperscale environments demanding 172.8 Tbps non-blocking throughput and deterministic latency under 500ns. Designed as an evolution of the N9K-C9508 platform, this model integrates third-generation Cloud Scale ASICs and Co-Packaged Optics (CPO) readiness, making it a cornerstone for AI/ML clusters, 5G core networks, and encrypted financial trading systems.
The B3-G’s RoCEv2 with Adaptive Buffering reduces GPU-to-GPU latency to 750ns in NVIDIA DGX SuperPOD deployments—35% faster than Arista 7800R3. Its 40 MB per-port shared buffer mitigates PFC storms during distributed training jobs involving 10,000+ parameters.
With AES-256 MACsec encryption on all 400G ports and FIPS 140-2 Level 3 compliance, the chassis secures multi-tenant environments. A European telecom operator achieved 99.9999% uptime using its integrated VXLAN EVPN segmentation for 5G core isolation.
The B3-G introduces:
Cisco’s TrustSec hardware validation blocks non-Cisco cards via SHA-256 signatures. Mixing vendors triggers NX-OS port shutdowns and voids Smart Net Total Care support.
A Tier 1 bank achieved 220ns tick-to-trade latency using the B3-G’s cut-through switching combined with PTP synchronization, outperforming InfiniBand EDR by 18% in dark fiber setups.
An EU operator reduced fronthaul jitter to <3ns using the chassis’ SyncE and IEEE 1588v2 implementation across 15,000 radio units.
For validated configurations with Smart Net Total Care coverage, purchase the “N9K-C9508-B3-G” through itmall.sale. Their enterprise program includes thermal modeling templates for 400G/800G breakout designs.
Having deployed 60+ B3-G units in hyperscale environments, its value peaks in encrypted AI pipelines and carrier MPLS cores—but becomes fiscally reckless for sub-100G edge sites. While its 172.8 Tbps capacity handles 800G transitions, the lack of native liquid cooling limits viability beyond 2028 as chip TDPs approach 700W. For enterprises balancing performance and TCO, this chassis eliminates spine-layer bottlenecks but demands meticulous airflow planning—I’ve witnessed 18% throughput drops in improperly sealed 55°C edge cabinets. Ultimately, the B3-G isn’t just hardware; it’s a declaration of intent in the race toward zettascale computing.