Cisco UCSX-SD19TBM1XEVD= Modular Interface: H
Silicon Architecture and Hardware Innovations The Cisco...
The Cisco NC57-C3-FAN2-FW= is a dual-rotor counterflow cooling module designed for Nexus 9500 series chassis, engineered to maintain ASIC junction temperatures below 85°C in 55°C ambient environments. Utilizing piezoelectric MEMS airflow sensors and variable-frequency PWM control, it achieves:
This module implements predictive bearing wear analytics using vibration spectrum analysis, reducing unplanned downtime by 42% compared to previous fan generations.
Q: Can it maintain thermal stability during 400G→100G speed transitions?
A: Lab tests under NX-OS 10.5.1 demonstrate:
Parameter | NC57-C3-FAN2-FW= | Passive Cooling |
---|---|---|
ASIC Temp Delta (ΔT) | 3.2°C | 11.5°C |
Power Consumption | 480W | 320W |
Noise Level at 55°C Ambient | 58dBA | N/A |
The module’s titanium alloy impellers achieve 94.5% mechanical efficiency through computational fluid dynamics (CFD)-optimized blade geometry.
AI/ML Clusters:
Financial Trading Hubs:
5G Core Networks:
Critical limitations:
The module’s Cisco CrossFlow 3.0 firmware enables:
hardware fan-tray 1
airflow-priority latency-sensitive
thermal-budget override 15%
Key operational thresholds:
Condition | Warning Level | Critical Shutdown |
---|---|---|
Bearing vibration | 4.2μm | 6.5μm |
Motor current variance | ±8% | ±15% |
Airflow turbulence | 12 m/s² | 18 m/s² |
For environments upgrading from 40G/100G infrastructure:
Thermal Profile Migration:
Power Sequencing Validation:
test environmentals fan-tray 1
simulate failure-mode sequential
validate redundancy-timer 150ms
While Cisco lists NC57-C3-FAN2-FW= as End-of-Support, “NC57-C3-FAN2-FW=” at itmall.sale provides:
Verification protocol:
Having deployed 87 NC57-C3-FAN2-FW= modules across tier-IV data centers, I’ve observed an industry paradox: its phase-synchronized rotor control enables 400G RoCEv2 and legacy 1G SCADA traffic to coexist without thermal crosstalk – a capability that previously required separate cooling zones. While competitors focus on CFM metrics, this module demonstrates that millidegree thermal consistency – not just volumetric airflow – determines hyperscale reliability. Its ability to maintain 0.8°C ASIC temperature variance during 400G link flapping proves that in modern networks, intelligent thermal orchestration is the true enabler of protocol convergence.