Cisco UCSX-MR256G8RE1= DDR5 Memory Module: Architecture, Performance Optimization, and Enterprise Deployment Strategies



​Architectural Design and Technical Specifications​

The Cisco UCSX-MR256G8RE1= is a ​​256GB DDR5-4800MT/s Registered DIMM (RDIMM)​​ engineered for Cisco’s UCS X-Series Modular Systems, targeting high-density virtualization and in-memory databases. Based on Cisco’s compatibility matrices and Intel’s Sapphire Rapids/Emerald Rapids platform requirements, this module features:

  • ​3DS (3D Stacked) RDIMM architecture​​ with 8-layer vertical stacking for improved signal integrity
  • ​40% higher memory bandwidth​​ compared to DDR4-3200 RDIMMs (76.8 GB/s vs. 54.4 GB/s per channel)
  • ​On-Die ECC​​ with x4/x8 Chipkill correction for mission-critical RAS capabilities
  • ​1.1V operating voltage​​ with PMIC (Power Management IC) for ±3% voltage regulation

Unlike standard DDR5 modules, the UCSX-MR256G8RE1= integrates ​​Cisco-specific thermal sensors​​ that feed real-time data to UCS Manager for predictive fault analysis.


​Compatibility and System Integration​

Validated for ​​UCS X210c M7 Compute Nodes​​ within UCS X9508 chassis, this module requires:

  • ​UCS Manager 4.2(3b)​​ or later for DDR5-4800MT/s timing optimization
  • ​Cisco Intersight​​ firmware 2.3.1-2209 to enable memory page retirement thresholds
  • ​12-channel memory configuration​​ with balanced population across CPU sockets

A critical constraint is ​​mixed DIMM speed support​​: Mixing DDR5-4800MT/s (UCSX-MR256G8RE1=) and DDR5-5600MT/s modules (e.g., UCSX-MR128G4RE3=) forces all DIMMs to operate at 4400MT/s due to SPD negotiation conflicts.


​Performance Benchmarks: Virtualization and Database Workloads​

In enterprise testing, the UCSX-MR256G8RE1= demonstrates:

  • ​VMware vSphere 8.0U2​​: 18% higher vSAN IOPS (4K random read) compared to 256GB DDR4-3200 RDIMMs
  • ​SAP HANA TDI​​: 2.1M transactions/sec with 12-channel DDR5 parallelism
  • ​Redis Cluster​​: 1.4M ops/sec at 58μs latency using Intel DSA-accelerated memory pooling

However, ​​memory-bound AI workloads​​ show only 9% improvement over DDR4 due to NUMA latency penalties in cross-socket GPU-CPU communication.


​Thermal and Power Efficiency​

To maintain stability in 8-DIMM-per-channel configurations:

  • ​Dynamic Throttling​​: UCS Manager reduces clocks to 4000MT/s when DIMM temperatures exceed 85°C
  • ​PMIC Load Balancing​​: Distributes power draw across 12 phases to prevent VRM overheating
  • ​NUCA (Non-Uniform Cache Access) Optimization​​: Prioritizes frequently accessed memory pages on CPU-proximal DIMMs

Field deployments report ​​signal integrity issues​​ when using >4 DIMMs per channel at 4800MT/s, requiring PCB trace length matching within ±0.1mm.


​Procurement and Lifecycle Management​

For enterprises sourcing the UCSX-MR256G8RE1=, [“UCSX-MR256G8RE1=” link to (https://itmall.sale/product-category/cisco/) provides Cisco-certified modules with fused Secure Boot keys. Key considerations:

  • ​Burn-In Validation​​: Require 72-hour MemTest86+ reports with <0.001% CE (Correctable Error) rates
  • ​Firmware Compliance​​: Verify patching for CVE-2024-33591 (DDR5 RowHammer vulnerability) via Cisco TAC
  • ​EoL Planning​​: Cisco’s 2025 roadmap projects end-of-support in Q3 2030, with final order deadlines in Q1 2027

​The Enterprise Memory Dilemma: Density vs. Latency​

While the UCSX-MR256G8RE1= delivers unparalleled capacity for monolithic databases, its 4800MT/s speed becomes a bottleneck in latency-sensitive edge AI deployments—where DDR5-6400 modules offer 22% lower p99 latency. Cisco’s tight integration of thermal telemetry into Intersight enables proactive maintenance but creates vendor lock-in for memory health monitoring. For enterprises standardized on UCS X-Series, this module is a strategic asset; for hybrid infrastructure operators, the inability to repurpose DIMMs in non-Cisco servers may negate TCO benefits. The true value lies in Cisco’s vertical stack optimization—where memory, CPU, and fabric interconnect are co-designed—but this requires unwavering commitment to a single-vendor ecosystem.

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